tosi_stackhouse.h

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// ------------------------------------------------------
//
// SPDX-License-Identifier: GPL-2.0-or-later
//
// SPDX-FileCopyrightText: Copyright (C) 2025-2026 by the ASPECT authors.
//
// This file is part of ASPECT.
//
// Detailed license information governing the source code and
// contributions can be found in the folder LICENSES and in
// LICENSE and CONTRIBUTING.md at the top level directory.
//
// ------------------------------------------------------

#ifndef _aspect_material_model_thermal_conductivity_tosi_stackhouse_h
#define _aspect_material_model_thermal_conductivity_tosi_stackhouse_h

#include <aspect/material_model/thermal_conductivity/interface.h>


namespace aspect
{
  namespace MaterialModel
  {
    namespace ThermalConductivity
    {
      using namespace dealii;

      template <int dim>
      class TosiStackhouse : public Interface<dim>, public aspect::SimulatorAccess<dim>
      {
        public:
          void evaluate (const MaterialModel::MaterialModelInputs<dim> &in,
                         MaterialModel::MaterialModelOutputs<dim> &out) const override;

          static
          void
          declare_parameters (ParameterHandler &prm);

          void
          parse_parameters (ParameterHandler &prm) override;

        private:
          std::vector<double> conductivity_transition_depths;
          std::vector<double> reference_thermal_conductivities;
          std::vector<double> conductivity_pressure_dependencies;
          std::vector<double> conductivity_reference_temperatures;
          std::vector<double> conductivity_exponents;
          std::vector<double> saturation_scaling;

          double maximum_conductivity;
      };
    }
  }
}

#endif